Our SAS 3.0/4.0 series connectors deliver exceptional data transfer speeds of up to 24 Gb/s, ensuring stable and efficient transmission for enterprise storage and server systems. Designed with high reliability and hot-plug capability, each connector undergoes strict quality control and automated precision manufacturing. With flexible customization options and strong R&D support, our SAS connectors are ideal for both board-to-board and wire-to-board applications in enterprise storage systems, servers, and data centers requiring consistent, high-speed performance. ShuangYi Precision — Powering Smarter Connections.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
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The SAS 29P SMT Female Connector is designed for high-speed, reliable signal transmission. Featuring 15µ" gold-plated contacts and 100µ" tin-plated solder areas, this connector ensures excellent electrical conductivity and stable, long-term performance in demanding applications.
Constructed with LCP UL94-V0 housing and C5191-H phosphor bronze terminals, it provides durability and thermal resistance, ensuring reliable mechanical and electrical performance. The 1.27mm pin pitch and SMT configuration make it ideal for high-density PCB designs.
This connector is particularly suitable for automotive electronics, industrial control systems, telecommunication equipment, and high-speed data transmission applications. The RoHS 2.0 compliance ensures it meets global environmental standards.
| Product Type | SAS 29P Female SMT Connector |
| Contact Area Plating | 15µ" Gold Plating (G/F) |
| Solder Area Plating | ≥ 80µ" Matte Tin (Sn) |
| Housing Material | LCP (Liquid Crystal Polymer), UL94-V0, Black |
| Terminal Material | Phosphor Bronze C5191-H, t = 0.25mm |
| Pin Pitch | 4.20mm |
| Pin Length | 5.6mm |
| Operating Temperature | –20°C to +85°C |
| Rated Current / Voltage | 1.5A @ 40VAC |
| Contact Resistance | ≤ 30mΩ |
| Insulation Resistance | ≥ 1000MΩ (500V DC) |
| Withstand Voltage | 500VAC / 1 minute |
| Insertion Force | ≤ 25N (Backplane) |
| Unmating Force | ≥ 5N (Backplane) |
| Terminal Retention Force | ≥ 1.0 Kgf per pin |
| Durability | 500 cycles (per EIA 364-09) |
| Salt Spray Test | 48 hours |
| Environmental Compliance | RoHS 2.0 + Halogen-Free |
| Pin Width | 1.2mm |
| Recommended PCB Layout | 1.27mm PCB hole size |
Key Features
- Gold-Plated Contacts (15µ") for superior electrical conductivity and long-lasting performance
- Matt Tin Solder Areas (≥80µ") for durable and secure PCB mounting
- LCP UL94-V0 Housing provides high thermal stability during reflow soldering
- Low Contact Resistance (≤ 30mΩ) for stable signal transmission
- Strong Mechanical Retention with ≥1.0 Kgf per pin
- Durable Performance with 500 mating cycles
- RoHS 2.0 + Halogen-Free Compliant for environmental sustainability
- Ideal for High-Density PCB Designs with a compact 4.20mm pitch
⚙️ Applications
1. Server & Storage Devices
SAS HDD/SSD modules
RAID controller boards
Server backplanes
High-speed data transmission lines
2. Communication Equipment
Network routers and switches
Optical-electrical conversion modules
Edge computing devices
3. Automotive Electronics
ADAS data modules
In-vehicle storage interfaces
ECU signal connectors
4. Industrial Control Systems
PLC controllers
Industrial computers
Data acquisition boards
5. PCB & High-Speed Signal Designs
Multi-board connectivity
Fine-pitch high-density boards
High-speed signal routing applications
⚠️ Notes
- Ensure proper PCB layout to match the 4.20mm pin pitch to avoid misalignment during assembly.
- Use proper soldering temperatures to prevent LCP housing deformation during reflow soldering.
- Keep the gold-plated contact area clean and free from contamination or oxidation.
- Verify contact resistance and insulation resistance meet application specifications.
- Avoid excessive mechanical force during mating and unmating to preserve terminal integrity.
- Store connectors in dry, anti-static packaging until use to avoid damage.
- Maintain ESD protection throughout the assembly process to avoid electrostatic discharge damage.
