Design PCB pads and solder mask strictly according to the recommended land pattern to ensure proper solder fillet and coplanarity.
Avoid exceeding specified current and voltage ratings; derate appropriately at elevated ambient temperatures.
Follow standard SMT reflow temperature profiles suitable for high-temperature thermoplastic; avoid multiple reflow cycles beyond connector specifications.
Keep contacts free from flux residues, dust or oil; contamination may increase contact resistance or reduce insulation performance.
When used in high-vibration automotive or server applications, ensure mating connector or cable assembly includes suitable retention features and strain relief.
Store connectors in their original packaging, in a dry environment, to prevent terminal oxidation before assembly.
